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February 1999

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Subject:
From:
"Carano,Michael" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 25 Feb 1999 14:46:41 -0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (64 lines)
In each of the last two years, the IPC has conducted a "Summit on PWB
Surface Finishes and Solderability." The proceedings contain a great deal of
the information that you request.
Contact John Riley at the IPC to obtain copies.

Best regards,

Mike Carano

> -----Original Message-----
> From: Christoph Haselmayer
> [SMTP:[log in to unmask]]
> Sent: Thursday, February 25, 1999 3:16 AM
> To:   [log in to unmask]
> Subject:      [TN] PWB Materials strategy
>
> Hello,
>
> I am working on a materials strategy for PWBs. What is the outlook for PWB
> finishes? What I am interested in is:
>
> - surveys about the world market situation (shares) of mainstream finishes
> now
> and in the next lets say 5-10 years (HAL, OSP, e'less Ni/Au, immersion
> Sn).
> - will OSP increase and maybe constitute a costeffective alternative to
> HAL?
> - will HAL definetly die? (lead ban discussion)
> - differences between world markets (US, Europe, Asia), different
> strategies.
>
> - issues, major aspects, pros and cons of these finishes (especially OSP).
>
> Your input is greatly appreciated
>
>
> Christoph
>
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