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February 1999

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Subject:
From:
Rob Schetty <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 25 Feb 1999 08:43:37 -0500
Content-Type:
text/plain
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Try "Reflow Soldering to Gold", by Sherman Banks of Trimble Navigation, Ltd.
It appeared in "Electronic Packaging and Production"`s June 1995 issue.
Rob Schetty
Shipley/Shipley Ronal
Freeport NY  USA
-----Original Message-----
From: Richard G. Wenda <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Thursday, February 18, 1999 2:21 PM
Subject: [TN] gold embrittlement


     Dear TN,

     I am looking for a white paper or perhaps an article on the effects of
     gold volume to solder reflow reliability.  Apparently NCMS had an
     article in ~spring of '96, co-authored by Wenger and Janus,
     determining that 3% was an allowable percentage.

     If you know how I can find this paper I would appreciate it.  If you
     know of more recent studies that might help as well.

     Thank you, Rich.

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