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February 1999

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Subject:
From:
Ian Boyton <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 25 Feb 1999 04:28:34 PST
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FMEA tests will help you determine the "cost" of rework. Generally
though the less rework the better, as then there are less processes to
damage boards, less people, less handling, less mistakes etc. Note that
hot air tools should be used on mechanically sensitive parts.

Ian Boyton


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>Date:         Wed, 24 Feb 1999 15:37:04 -0500
>Reply-To:     "TechNet E-Mail Forum." <[log in to unmask]>,
>              "Diaz, Lourdes" <[log in to unmask]>
>Sender:       TechNet <[log in to unmask]>
>From:         "Diaz, Lourdes" <[log in to unmask]>
>To:           [log in to unmask]
>
>Technet,
>
>Has anyone done a study on the correlation of board reliability vs. the
>number of components replaced by board?
>We have a certain amount of boards we will like to convert into another
>product.     The conversion requires component to be deleted and/or
added.
>Quantity of components to be deleted/added varies from 3 to 75
depending on
>the configuration we want to go to.    85% of the components to be
replaced
>are SMT discrete components the rest are TH capacitors, (x5 leads)
>transformers.   These boards had been through 2 SMT
processes(components top
>and bottom) and wavesolder.    One is a 8 layer board, 0.062" thick,
SOBC,
>wet film soldermask, 5.51" wide by 8.17" long.     The other one is a 2
>layer board, 0.062" thick, SOBC, wet film soldermask, 7.44" wide by
11.995"
>long.
>How much rework can one do to the board and still feel confident that
the
>product won't fail in the field?
>
>Thanks,
>
>Lourdes Diaz
>Manufacturing Engineering
>Milgo Solutions, INC
>[log in to unmask]
>
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