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February 1999

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Subject:
From:
Ger Vowles <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 24 Feb 1999 22:43:52 -0000
Content-Type:
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Don:
I am a manufacturing who has been working with Entec 106A coatings on
motherboards for the past 3 years.
In this period of time I have developed somewhat of a knowledge of the
process required for this type of product.

The flow-through to the top side of your board will improve if you try the
following flux Alpha RF800 this is a rosin based flux and the best results
will be seen by spray fluxing application.
(also ensure that the extraction on your fluxer is correctly specified as
the fumes can be quite strong)
Bring your top side temp pre wave to 100 deg/c and watch the results. The
activity level of this flux will outweigh the benefits of NR310B ( If I am
not mistaken this is a VOC free...  good but little activity for the entec
finish I carried out line trials on this and saw the same problems...)

We were told the same information from the Entec people re the 12 hrs.. the
area that we look more closely at however is the misprinted PCB cleaning .
these must go through the full process within 4 hrs of being misprinted..
this time is determined by the cleaning solution used for cleaning the
misprints.

With reference to paste's and the reflow temperatures , paste manufacturers
have a group of OSP versions again the big one's UP78-osp (alpha)  any
vendor really.

If you wish to contact me of line I can organize some further information
if you require.

Ger...

----------
> From: Don E Steffen <[log in to unmask]>
> To: [log in to unmask]
> Subject: [TN] Experience with No Clean Paste and No Clean Flux
> Date: 14 January 1999 17:27
>
>      Hi all!
>
>      Is there anyone out there that has experience on the use of No Clean
>      Solder Paste and Flux?
>
>      I am having a problem with organic coated boards, in that the time
>      period between reflow oven and the wave solder appears to be a big
>      problem. I can not get good reflow to the top side of through
>      components in order to meet the requirements of IPC Class III. I am
>      told by board manufacturers that I should be able to wait up to 12
>      hours between reflow and wavesolder. The organic coating we are
using
>      is ENTEK PLUS made by Enthone.
>
>      What am I doing wrong?
>
>      Is organic coating degradation directly proportional to reflow
>      temperature?
>
>      Is there anyone out there that has data on a DOE that I can get a
hold
>      of?
>
>      Maybe the flux I am using is inadequate, without any sales pitch,
what
>      is a good No Clean Flux that someone has experience with that is
>      capatible with Organic Coated boards? I am presently using Alpha
>      NR310B!
>
>      What is an acceptable solder pot temperature for the use of Organic
>      Coated boards?
>
>      Signed
>
>      I Need Help
>
>      Donn Steffen/VDO Control Systems
>
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