Technet,

Has anyone done a study on the correlation of board reliability vs. the
number of components replaced by board?
We have a certain amount of boards we will like to convert into another
product.     The conversion requires component to be deleted and/or added.
Quantity of components to be deleted/added varies from 3 to 75 depending on
the configuration we want to go to.    85% of the components to be replaced
are SMT discrete components the rest are TH capacitors, (x5 leads)
transformers.   These boards had been through 2 SMT processes(components top
and bottom) and wavesolder.    One is a 8 layer board, 0.062" thick, SOBC,
wet film soldermask, 5.51" wide by 8.17" long.     The other one is a 2
layer board, 0.062" thick, SOBC, wet film soldermask, 7.44" wide by 11.995"
long.
How much rework can one do to the board and still feel confident that the
product won't fail in the field?

Thanks,

Lourdes Diaz
Manufacturing Engineering
Milgo Solutions, INC
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