When you use cap lamination in a rigid pwb your outer layers of copper were
actually bonded using foil lamination.  The difference is that they were bonded
by the laminate supplier and not the pwb fabricator.  There is no inherent
reason why the peel strength of the copper to prepreg should be any better or
worse depending on who bonded the copper there in the first place.  The thing
that you might want to do is to test your specific suppliers boards made with
foil lamination vs. cap.  The specific materials and processing differences from
one pwb supplier to another or one laminate supplier to pwb supplier could be
significant which could give you different peel results.  I do not know of any
testing that has been performed that would represent all foil vs. cap lamination
performed anywhere.

In the past I worked for a couple of pwb suppliers.  We would suggest that
customers switch from cap lamination to foil lamination to improve registration,
save cost on the overall construction, and give us more flexibility in the type
of prepreg we could use etc.  Other than improved registration we and our
customers never saw any other difference in the performance of the pwb's.
(peel strength etc. was verified)



The above mentioned comments and opinions are my own.  They do not reflect or
represent that of my employer.

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