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February 1999

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Subject:
From:
WM Cheng <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 24 Feb 1999 10:43:47 +0800
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text/plain (22 lines)
        Hi Technetters,
        Refer to IPC-SM-782, which mention about robber pads to reduce
        solder bridging but doesn't mention about size and shape, is
        there any simple calculation method/rule to design a robber
        pad for the SOIC and TO220 package for wave soldering process?

        Thanks,
        WM Cheng
        [log in to unmask]

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