Vickie -

A picture is worth 1k words. Why not grab your sections and bring them over
to our lab for a second opinion. We're in your neighborhood, across from NH
Tech in Nashua; just give us a call.

Cheers!

Bob Lazzara
Circuit Connect Tech Support

TEL: 800.560.9457    FAX: 888.453.0520    BBS: 603.889.5385
alternate eMail: [log in to unmask]

-----Original Message-----
From: Vickie Dycewicz <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Tuesday, February 02, 1999 1:02 PM
Subject: [TN] Removing Debris from Holes before Electroless Deposition


>I am looking for information on what companies are using to remove debris
in
>holes before the electroless deposition (dep) process.
>
>We are getting pth voids in holes due to drill debris still in the holes
after
>deburr, before dep. Cross section pictures of the pth void show a
circumfrential
>void, near the center of the hole. The electroless copper leading up to the
void
>is very granular, as if trying to dep over debris. I do not classify them
as
>bubble voids because of the debris still left in the hole.
>I predominately see these voids in 0.022 holes, 0.261 panel thickness.
>After drill the panels are hand sanded, then through our deburr process
which is
>an IS Scrubbex with 350psi high pressure spray section.
>
>I would greatly appreciate any suggestions on how to improve my process.
>
>Thanks,
>Vickie Dycewicz
>Electroless Deposition Process Engineer
>Teradyne, Inc.
>Nashua, NH
>
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