I am looking for information on what companies are using to remove debris in
holes before the electroless deposition (dep) process.

We are getting pth voids in holes due to drill debris still in the holes after
deburr, before dep. Cross section pictures of the pth void show a circumfrential
void, near the center of the hole. The electroless copper leading up to the void
is very granular, as if trying to dep over debris. I do not classify them as
bubble voids because of the debris still left in the hole.
I predominately see these voids in 0.022 holes, 0.261 panel thickness.
After drill the panels are hand sanded, then through our deburr process which is
an IS Scrubbex with 350psi high pressure spray section.

I would greatly appreciate any suggestions on how to improve my process.

Thanks,
Vickie Dycewicz
Electroless Deposition Process Engineer
Teradyne, Inc.
Nashua, NH

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