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February 1999

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Date:
Thu, 18 Feb 1999 15:18:50 -0400
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Gold contact rework

We are replating gold contacts that has been contaminated with solder  
paste.  The process is to remove the solder paste from the contacts, clean  
the area and then apply gold using the same principle of pcb gold plating.   
Is there any reliability issue with such process?  Is there any particular  
analysis to validate the process?

Any information in this matter will be helpful.

Enid Dávila

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