Hi Rich - get a copy of the following: "The Effect of Gold on the
Reliability of Fine Pitch Surface Mount Solder Joints" , authors
Glazer,Kramer, Morris Jr., Circuit World, vol 18, No. 4, 1992, pages 41-46.
It contains the information you are looking for. Good Luck.

Dave Hillman
Rockwell Collins
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"Richard G. Wenda" <[log in to unmask]> on 02/18/99 12:39:00 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
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Subject:  [TN] gold embrittlement




     Dear TN,

     I am looking for a white paper or perhaps an article on the effects of
     gold volume to solder reflow reliability.  Apparently NCMS had an
     article in ~spring of '96, co-authored by Wenger and Janus,
     determining that 3% was an allowable percentage.

     If you know how I can find this paper I would appreciate it.  If you
     know of more recent studies that might help as well.

     Thank you, Rich.

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