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February 1999

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Subject:
From:
"Alderete, Michael" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 18 Feb 1999 10:45:18 -0800
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Steve-

At previous employer, we specified, for example:

.025" dia. nominal pad
.031" dia. nominal clearance hole on soldermask
& soldermask registration of .003" dia. TP (true position)

such that at maximum allowable SM misregistration (.003" in any direction),
solder mask opening would at worst case be tangential to pad, and thus not
overlap the pad at all.

Board houses had no problem with this SM positional tolerance callout (10
layer glass-PI all SMT PWBs).

Michael Alderete



You wrote...
------------------------------

Date:    Wed, 17 Feb 1999 16:51:36 -0800
From:    "Joy, Stephen C" <[log in to unmask]>
Subject: Solder Mask Clearances on dogbone vias

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We are looking at the design rules for soldermask clearances on mini BGAs.
The current rules say the solder mask will be .006" greater than the nominal
hole size.
I have 2 questions.
What is the resolution capability of solder masks? Can solder masks reliably
resolve a .006" line?
What is the current capability for solder mask registration? I would like to
spec nominal FHS+.002"/side as the solder mask opening with no s/m in the
hole.
Thanks,
Steve

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