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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 18 Feb 1999 10:39:00 -0800 |
Content-Type: | TEXT/PLAIN |
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Dear TN,
I am looking for a white paper or perhaps an article on the effects of
gold volume to solder reflow reliability. Apparently NCMS had an
article in ~spring of '96, co-authored by Wenger and Janus,
determining that 3% was an allowable percentage.
If you know how I can find this paper I would appreciate it. If you
know of more recent studies that might help as well.
Thank you, Rich.
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