TECHNET Archives

February 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Galvanic reactions
From:
Dave Hoover <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 18 Feb 1999 10:41:43 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (25 lines) 
Michael also keep in mind that a gold finish is smoother than solder.
The etchant will move across faster and tend to puddle less on gold.
The solder has more surface topology and tends to puddle more and
require more time through the etcher.

Just my observations......

I've also seen solutions with Thiorea create strange galvanic situations.
It sometimes generates some energy that can deplate and replate
in some of the strangest situations. <Gremlins again>

Groovy

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2