TECHNET Archives

February 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Christopher Jorgensen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 17 Feb 1999 16:52:34 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (28 lines)
I was wondering if you could provide a source where I can get copper samples for
performing a solderability test.  The samples don't necessarily need to be oxygen
free, as we can bright dip finish them here.  OSP coating is also not a requirement.
I would appreciate any information you might have.

Thanks again,

Brian Looney
Manufacturing Engineer
Laughlin-Wilt Group
9825 SW Sunshine Ct
Beaverton, OR  97005
(503) 672-4370
fax: (503) 641-9145
email:  [log in to unmask]

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2