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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 17 Feb 1999 11:59:21 -0500 |
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It would not be at all unexpected to observe a higher relative
concentration of tin in an area determined to have a "thin" HAL deposit.
The XRF is responding to the ratio of tin to lead, and given you are
approaching the copper/solder interface, and more specifically the
tin/copper interface, it would be naturally preferential to tin
concentration.
Sounds like you are within expected conditions, other than the thin solder
deposits. May I assume they are on larger ground areas? There is a direct
correlation between deposit thickness and area size under given conditions
Hope this helps!
Joseph Webb
TET/Halco
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