From: Dennis J Fall@TFT on 02/17/99 11:39 AM


To:   [log in to unmask]
cc:
Subject:  Plating solder onto isolated areas

I have been trying to find a way to plate solder onto isolated area on a
substrate.  I need anywhere from 4-25 microns of solder covering copper
pads that are isolated from any other metal.  So, electroplating may be
possible, but it is a matter of finding out how to do this.  If there are
any ideas, please respond.

Thank You,

Dennis Fall                        P: 507-625-8445 x17

Engineer                           F: 507-625-3523

Thin Film Technology Corporation         mailto:[log in to unmask]

1980 Commerce Drive                http://www.thin-film.com

North Mankato, MN 56003-1702

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