Good Morning Technetters,

Thanks for all the help on the board shop for the mil spec multilayer
board.  I have passed the info on to the powers that be.  Today I have a
different problem, pertaining to SMT assy and solder paste.

We have made a board that has 15 mil pitch, using 8 mil pads connected
to 8 mil tracks (some).  The problem is that the SMT is cleared on the
ends by 5 mils and the track width is pulling the paste from the pad and
causing the part not to adhere.  What can we do to block the paste from
traveling down the track at this point.  We have the boards made and
would prefer a good rework procedure instead of remaking the boards.

Thanks in advance for the assistance.

Anne Ledger
Mfg. Engineering Dept
EMDS, Inc.
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