Hello All

  We have to characterize new plasma machine for PC board desmear / etchback
processing.
One of the plasma equipment manufacturer is proposing to us new plasma
etching system based on high RF frequency of 13.56 MHz, this system should
give us faster etch rates (comparing to 40 KHz system) but on the opposite
we understood from others that it is difficult to make tuning & power
matching to ensure less robust process.
Second subject: Regarding the gas that used for etching, Is someone has
experience with using NF3 for desmear / etchback processes as a replacement
to CF4/O2 gases ?
We will appreciate any comments.


Shabtay

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