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February 1999

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Subject:
From:
Paul Klasek <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 16 Feb 1999 11:05:39 +1100
Content-Type:
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Not another white residue season !
Every time Euro or States get snowed under this thing pops up !

No kidding George ; if you go to IPC files under "white residue" heading '
you'll understand why am I terrified of avalanches ;
it's been answered at least 100x over in depth .

Your's friendly fellow in flux

Paul Klasek
http://www.resmed.com

> ----------
> From:         Calvas, George (G.)[SMTP:[log in to unmask]]
> Sent:         Tuesday, 16 February 1999 7:48
> To:   [log in to unmask]
> Subject:      [TN] White Residue between Solder Pads
>
> I read a posting on white residue between solder leads.  I was hoping you
> could give me insight of the probability of dendridic growth based on the
> solder/flux combinations as well as the different cleaning solutions that
> are used.  I have been told that the residue (flux or cleaning solution?)
> with proper humidity, bias and temperature could cause dendridic growth to
> spread across adjacent  leads which would obviously be a detrimental
> failure.  I am using surface mount devices of .050 spacing and .025 lead
> width on an FR4 material.  One final question, Is it the residual flux or
> the cleaning solution or both that causes this anomaly.  I would
> appreciate
> any insight to this problem.  Thank You.
>
> George Calvas
> Visteon Racing
> Visteon Automotive Systems
> Tel: 734-458-0307
> e-mail:  [log in to unmask]
>
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