I read a posting on white residue between solder leads.  I was hoping you
could give me insight of the probability of dendridic growth based on the
solder/flux combinations as well as the different cleaning solutions that
are used.  I have been told that the residue (flux or cleaning solution?)
with proper humidity, bias and temperature could cause dendridic growth to
spread across adjacent  leads which would obviously be a detrimental
failure.  I am using surface mount devices of .050 spacing and .025 lead
width on an FR4 material.  One final question, Is it the residual flux or
the cleaning solution or both that causes this anomaly.  I would appreciate
any insight to this problem.  Thank You.

George Calvas
Visteon Racing
Visteon Automotive Systems
Tel: 734-458-0307
e-mail:  [log in to unmask]

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