I have come across a phenomenon that puzzles me.

We have discovered microballs on a solder joint associated with an SOIC.
As best we know, there have only been one or two occurrences, but the
product is for a high rel application so we are keen to explore it further.

The solder balls appear in a little pile, stretching away from the joint
for about .025 inches.  They are piled up, and the area of the deposit is
about 25mils by 10mils.

The joint itself looks fine, and there are no other defects apparent
elsewhere.

I'm interested to see if anyone can suggest any possible cause.

NAK





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