TECHNET Archives

February 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
PCB Rework Reliability
From:
[log in to unmask]
Reply To:
TechNet E-Mail Forum.
Date:
Sat, 13 Feb 1999 02:56:34 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines) 
A fairly large company I work for has many resources within an advanced technology research group
providing rework requirements after reflow and wave cycles you describe. Our boards range from 12 to
30 layers with coresponding thicknesses encompassing yours. We are allowed three strikes and must
quit.

Though I am not provided the numbers to back up this requirement, initial quality observations
certainly indicate two times through the "automatic" repair/rework cycle is enough at the
temperatures (top and bottom side heating) these must type boards see to reflow acceptably. This
especially is true when reworking/replacing BGA type devices.

Earl Moon

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2