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February 1999

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Subject:
From:
Howard Lin <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sat, 13 Feb 1999 10:27:13 +0800
Content-Type:
text/plain
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text/plain (57 lines)
Actually, I have try 4 runs of sample by Omikron process in Taiwan  and
I found that solderability performance is very poor. Nobody can help me
to solve this trouble issue immediately.I maybe get something wrong, or
the Omikron process get homesick in Taiwan.

Howard

> -----原始郵件-----
> 寄件者:     [log in to unmask] [SMTP:[log in to unmask]]
> 傳送時間:       1999年2月12日 AM 02:13
> 收件者:   [log in to unmask]
> 主旨:   Re: [TN] Immersion Tin
> 
> Rudy,
>      This is the response I sent to Les.
> 
> Les,
>      What kind of tin immersion bath are you questioning?  I work with
> the
> Omikron White Immersion Tin.  In the case of Omikron you would keep
> the copper
> concentration under 4,000 ppm.  In most cases under normal use the
> concentration will stay below 1,000.
>      If you cool the bath and filter it with a one micron filter you
> will find
> the bath stays within limits fairly easy.
> 
> Stephen M. Wentz
> Florida CirTech
> 
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