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February 1999

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Subject:
Copper Cleaning/Deoxidizing
From:
Joseph Slanina <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 12 Feb 1999 07:01:51 -0600
Content-Type:
text/plain
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text/plain (22 lines) 
I am interested in which chemistries are being the most successfully used
in PWB preclean processes prior to photoresist applications. Are different
chemistries being used for rigid and flex product? What preclean
chemistries are being used prior to coverlay lamination? If antitarnish
chemistries are being used, are they used in a separate tank or used with
rinse waters? Our main problem is oxidation of copper prior to coverlay
lamination.

Any information or contacts would be greatly appreciated.

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