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February 1999

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Subject:
From:
Don E Steffen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 12 Feb 1999 07:57:32 -0500
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     Techno's

     Thanks Graham Collins for the suggestion.

     The program I am on is high tech with 25 mil technology.
     Approximately 1/2 of the board in component population is 0805
     components. The assembly is a four layer board with through hole
     technology.  The SMT is only on one side with the bottom side used for
     ICT. At the sametime we are trying to make this decision we are also
     changing over to No Clean paste and flux. Our experience with No Clean
     is very limited.  We will be using Selective Solder system with No
     Clean flux for the through hole components. Any PPM levels you can
     provide would be appreciated.

     Thanks

     Donn Steffen
     VDO Control Systems

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