Press Fit with OSP (organic coating over copper such as Benzyl Trimidizole
(sp?)) works very successfully.  However, some manufacturing process
changes may be required depending upon the press fit pin style  and
plating.  The lack of SnPb on the board does increase insertion forces to
some degree.

Cross sections should be taken when working with Ni/Au plated vias, as the
Ni is not as ductile as the copper, and some barrel cracking may occur,
depending upon pin design and forces.

Hope that helps.

Jim Herard
Mail/Dept  BNLE
Mgr, FJUW, 3rd shift Test and Inspect
IBM Interconnect Products , Microelectronics Div
Endicott NY 13760-5553
t/l 857-7026

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