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February 1999

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Subject:
From:
Edward Brunker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 12 Feb 1999 12:16:33 GMT
Content-Type:
text/plain
Parts/Attachments:
text/plain (152 lines)
     David,
     May I request that you remove the last 18 lines of advertising in your
     footer when addressing the forum.
     Your company name and phone no. would suffice.
     In your initial response to NAK, there was no information in your
     E-mail that would help Nick, or the rest of us, solder SSOP devices,
     other than getting in contact with you.
     Perhaps you could redeem yourself in my eyes by supplying some
     detailed suggestions for SSOP wavesoldering.
     You have responded by "enlightening me" with other crucial parameters.
     Thankyou for this useful information, I will inwardly digest and
     acknowledge a greater wisdom.
     Please advice what aperture size should we use?
     What flux should we use?
     What solder mask should we use?
     Please advise single or dual wave?
     What pad finish should we use?
     Never knew any of this......mmmmmm!!!!!
     Regards
     Edward Brunker


______________________________ Reply Separator _________________________________
Subject: Re: [TN] Wavesoldering SSOP's
Author:  <[log in to unmask]> at INTERNET
Date:    12/02/99 08:29


Ed
You must have been in some strange frame of mind whilst reading our reply to
Nick.What sort of cookies do
you eat ? Obviously not the same as our Anzac Cookies!  We certainly didn't impl
we were going to charge
for the Information. In fact Nick and I have many discussion's off line and are
od mates. Nicks intention
is to find out who else has had any experience in order to establish the best ap
oach for this
requirement.
We discussed the issue further off-line.
Further to your Technical comments, you may consider other parameters during thi
process.
i.e.
The type of Flux used (no clean?),
The Base substrate used,
The Type of Solder mask used,
Solder mask aperture size.
Approach angle into the Wave.
Whether to use Single or Dual wave.
The Dwell period.
The pad finish and protective coating.
there are many factors involved here. Its not just a matter of designing a land
ttern and hoping for the
best.
If the Product is a prototype for high volume then its worth doing some tests. I
its a low volume product
you need to justify a protoyping process.
If you use materials that will not yield good results you should consider reflow
g the component.
Its a matter of yield for this process and if you establish some costing of
havingto rework/touch up for
bridges on these processes versus the additional assembly process.

I hope this enlightens you some what.

(To believe anything is for free in this world is being a delusionist.)

You pay a price for everything in this world!

David Muscat

Edward Brunker wrote:

>      I wouldn't normally respond to a wave solder question, but since the
>      only response so far was one asking for money before they gave you the
>      information lets rally round and try to provide it for free.
>      My experiences of wave soldering are only with Water washable fluxes,
>      so activity level was higher.
>      As far as pad geometry is concerned, obtain a data sheet or measure
>      the width of your leads. Make your pads the same width as the maximum
>      lead width. Then measure the outer dimension of the device, from toe
>      to toe, or using the data sheet take the maximum value. The pads
>      should extend beyond the end of your toe as far as you dare. If you
>      have space then use it. The idea is long and thin. Thin to avoid
>      shorting and long to provide the quantity of solder. The further out
>      you go the more solder will wet to the pad and wick up to the lead. So
>      extend the pad out beyond by 30 mil (thou), 40 mil (thou), 50 mil
>      (thou) what will your CAD boys tolerate?
>      Also don't forget the usual thief pad at the end of the row.
>
>      Regards
>      Edward Brunker
>      (Good luck and don't pay any money for your help!)
>
> ______________________________ Reply Separator
_________________________________ > Subject: [TN] Wavesoldering SSOP's
> Author:  "TechNet E-Mail Forum." <[log in to unmask]>           Nicholas Kane
> <[log in to unmask]> at INTERNET
> Date:    11/02/99 15:58
>
> I wonder if anyone can give me their thoughts.
>
> I have been asked about the feasibility of wavesoldering soldering a
> Plastic SSOP package.  The SSOP (EIAJ code is SSOP36-P-450-0.8) is a 36
> pin, 0.8mm pitch device. The wavesolder machine has chip and quiet waves,
> good preheat and is totally inerted, and using no-clean flux.
>
> Thanks in advance
>
> NAK
>

--
Regards,

David Muscat

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