Jim

It is possible to pre heat the bond surface to 120 degrees C and increase
the ultrasonic energy to achieve a good bond >20g on pull test.

===== Original Message from [log in to unmask] (TechNet E-Mail Forum.) at
11/02/99 15:30
>We have a need to connect a rigid flex pc board to a very small optical
>module.  We are in the prototype process now, on our way to an
>instrument that will fly in space.
>
>We would like to wire bond using gold wire.  We are now to understand
>the bonded surface needs to be pre-heated to 145 degrees C!!. That may
>not be suitable for an assembled PC board.  Aluminum wedge wire on gold
>pads seems be prone to "purple plague".  This will be a very short run
>(2 protos, 20 flight units) so we are far more interested in quality
>than efficiency. This is not like connecting substrates to output pins.
>The module is 2.5" by 2.5".  We will be bonding through slots 1.5" long
>by .220" wide to a surface .062" below.  The bond pad size is .006" by
>.015".  When the two modules are together they are about a 2.5"cube.
>Is there anyone that can provide some information gained from experience
>or else where that may help make this a success?
>Thank you for your input.
>
>Jim Payne, Sandia National Labs [log in to unmask]
>
>
>James R. Payne    MTS
>MS 0967      Dept. 5706
>Sandia National Labs
>PO Box 5800
>Albuquerque,  NM   87185
>
>Phone:  (505) 844-3336
>FAX:     (505) 844-5993
>email:   [log in to unmask]
>
>################################################################
>TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
>################################################################
>To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
>To subscribe:   SUBSCRIBE TechNet <your full name>
>To unsubscribe:   SIGNOFF TechNet
>################################################################
>Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional
information.
>For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
>################################################################


Mark Austin (Process Engineer)
ACW Technology Limited
Hylton Road
Petersfield
GU32 3XX
ENGLAND

TEL - +44 (0) 1730 300000
FAX - +44 (0) 1730 266045

Email - [log in to unmask]

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################