We have a need to connect a rigid flex pc board to a very small optical
module.  We are in the prototype process now, on our way to an
instrument that will fly in space.

We would like to wire bond using gold wire.  We are now to understand
the bonded surface needs to be pre-heated to 145 degrees C!!. That may
not be suitable for an assembled PC board.  Aluminum wedge wire on gold
pads seems be prone to "purple plague".  This will be a very short run
(2 protos, 20 flight units) so we are far more interested in quality
than efficiency. This is not like connecting substrates to output pins.
The module is 2.5" by 2.5".  We will be bonding through slots 1.5" long
by .220" wide to a surface .062" below.  The bond pad size is .006" by
.015".  When the two modules are together they are about a 2.5"cube.
Is there anyone that can provide some information gained from experience
or else where that may help make this a success?
Thank you for your input.

Jim Payne, Sandia National Labs [log in to unmask]


James R. Payne    MTS
MS 0967      Dept. 5706
Sandia National Labs
PO Box 5800
Albuquerque,  NM   87185

Phone:  (505) 844-3336
FAX:     (505) 844-5993
email:   [log in to unmask]

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