I wouldn't normally respond to a wave solder question, but since the
     only response so far was one asking for money before they gave you the
     information lets rally round and try to provide it for free.
     My experiences of wave soldering are only with Water washable fluxes,
     so activity level was higher.
     As far as pad geometry is concerned, obtain a data sheet or measure
     the width of your leads. Make your pads the same width as the maximum
     lead width. Then measure the outer dimension of the device, from toe
     to toe, or using the data sheet take the maximum value. The pads
     should extend beyond the end of your toe as far as you dare. If you
     have space then use it. The idea is long and thin. Thin to avoid
     shorting and long to provide the quantity of solder. The further out
     you go the more solder will wet to the pad and wick up to the lead. So
     extend the pad out beyond by 30 mil (thou), 40 mil (thou), 50 mil
     (thou) what will your CAD boys tolerate?
     Also don't forget the usual thief pad at the end of the row.

     Regards
     Edward Brunker
     (Good luck and don't pay any money for your help!)




______________________________ Reply Separator _________________________________
Subject: [TN] Wavesoldering SSOP's
Author:  "TechNet E-Mail Forum." <[log in to unmask]>           Nicholas Kane
<[log in to unmask]> at INTERNET
Date:    11/02/99 15:58


I wonder if anyone can give me their thoughts.

I have been asked about the feasibility of wavesoldering soldering a
Plastic SSOP package.  The SSOP (EIAJ code is SSOP36-P-450-0.8) is a 36
pin, 0.8mm pitch device. The wavesolder machine has chip and quiet waves,
good preheat and is totally inerted, and using no-clean flux.

Thanks in advance

NAK





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