Nick,

This should work Fine!

As you may be aware we have  designed land patterns and fine tuned the process to make this viable in
yield.  of course you need to provide the right Parameters and land Pattern design.
Should you wish to have your colleague call me or email I would be pleased to discuss the requirement's
that would make it a successful process.


--
Regards,

David Muscat

MANAGER

CAD SERVICE BUREAU

Arqtek Design/AD Technological
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Nicholas Kane wrote:

> I wonder if anyone can give me their thoughts.
>
> I have been asked about the feasibility of wavesoldering soldering a
> Plastic SSOP package.  The SSOP (EIAJ code is SSOP36-P-450-0.8) is a 36
> pin, 0.8mm pitch device. The wavesolder machine has chip and quiet waves,
> good preheat and is totally inerted, and using no-clean flux.
>
> Thanks in advance
>
> NAK
>
> [tel: +613 9888 4311    fax: +613 9888 4241]
>
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