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February 1999

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Subject:
From:
Wade Oberle <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 10 Feb 1999 16:52:45 -0600
Content-Type:
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How are you measuring your tin and lead contents?  Per ASTM standards
for wet chemical analysis, there are special precautions required for
collecting a sample for chemical analysis to insure it is representative
of the mass.  Could your analysis method or sampling technique be in
error?

Wade Oberle

        -----Original Message-----
        From:   <Jason M. Smith> [SMTP:[log in to unmask]]
        Sent:   Wednesday, February 10, 1999 6:50 AM
        To:     [log in to unmask]
        Subject:        Re: [TN] solder composition

        Fellow Technetters:
             In your experiences, at what point will one start to see
differences in
        solubility in wave soldering.  I monitor our solder composition
and am starting
        to see my Tin deplete as time goes by.  I'm not seeing any
immediate defects,
        but am wondering what is the alarm point.  None of the other
contaminates are
        out of spec.  I just notice my Tin composition depleting and the
balance is the
        Pb.  Any thoughts?   I can give technical expectations from
looking at the
        Eutectic, but am looking for the experience point of view.

        Jason Smith
        Lexmark Electronics
        Process Materials Engineer

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