Hello Netters,

        We are currently looking for an answer to an Immersion tin question.
We previously ran a small amount of Copper through our Immersion tin bath and
limited the Cu build up in the bath to 100 PPM. We are increasing the amount of
copper processed in the bath significantly an do not wish to dump the bath
daily. The question is what should the Copper limit be to provide a good
immersion tin and still maintain a reasonable solderability?

Regards,
Les

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################