Earl,

I do not concur with the definition as described. I firmly believe, and
teach, that the definition of soldering must include the creation of
intermetallics, at least in the case of Sn/Pb and copper substrates.
Logically I expect it will extend to other materials as well, due to the
fundamental nature of the wetting and intermetallic formation mechanism.

I offer as evidence, a statement I usually make to the folks I am
instructing:

It is accepted that it is a common occurrence that copper will diffuse into
a working solder bath as a product of exposure to the copper substrate.
Show me a bath that is not accruing copper, and I will show you exposed
copper areas!

Am I wet (with solder) behind my ears?

JMW
TET/Halco

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