Hi Earl,

        I'm certainly no expert on metallurgy, but I have learned a bit. Well
so much for joining without diffusion. Some of these metals are going to
diffuse even at room temperature over time. The room temperature of tin/copper
at room temperature is well known. I havent looked at lead per se', but I
suspect that it will diffuse also, perhaps at a slower rate. I'll leave further
discussions up to the metallurgists.

Keep your Nose on the horizon !!
Les

>  From: [log in to unmask], on 2/9/99 5:07 PM:
>  Phil and everyone,
>
>  I have difficulty shaking Dr. Manko's old definition (as Werner so astutely
>  pointed out) soldering
>  is the joining of two metal surfaces, using a solder medium, without
>  requiring diffusion or
>  intermetallic formation. I recoginze we've come far since this time.
>  However, I must ask is it
>  possible to solder two metals (only their surfaces) without forming
>  intermetallics, at least
>  initially, under any condition short of time not being a factor?
>
>  Earl Moon
>
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