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February 1999

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Subject:
FW: Preventive Action From Boards Delamination
From:
"(No Name Available)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 10 Feb 1999 17:26:00 +0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (41 lines) 
Regards,
OH Yeoh
Solectron Technology Sdn. Bhd.
Supplier Quality Engineering
DID : 604 - 506 5650
email : [log in to unmask]


> -----Original Message-----
> From: Yeoh, Ooi Huat
> Sent: Wednesday, February 10, 1999 1:54 PM
> To:   [log in to unmask]
> Subject:      Preventive Action From Boards Delamination
>
> Dear Technetters,
>
> Could anyone share with me how to prevent the pcb from delamination in
> both pcb house and assembly house.
> 1) Storage (Temperature)
> 2) Packaging
> 3) Etc.
>
>
>
> Regards,
> OH Yeoh
>
>

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