TECHNET Archives

February 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Jim Douglas <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 9 Feb 1999 17:24:08 -0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (28 lines)
Hi,

Can anyone tell me who can supply the following Thermal Core for lamination into a Multilayer PCB.

Material is specified as follows;

IPC-MF-150/3-CU-E-3-29.6-D-V-2

It is a 0.040" thick Electro deposited HTE copper core with double sided bond enhancement treatment, with stain proofing both sides.

V = Very low profile, 2 = class 2

I need a supplier of this material either in Europe or USA.

Thanks in advance.

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2