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February 1999

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Subject:
Re: Defective BGAs?
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TechNet E-Mail Forum.
Date:
Tue, 9 Feb 1999 18:29:41 -0600
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I am reminded of a direct and timely correspondence from Motorola (though now somewhat dated - an
invitation to those kind folks to once again join in) concerning phosphorous/nickel intermetallic
formations (from electroless nickel deposition process) rendering both BGA device and PCB
bond/solder joint reliability null and void.

Earl Moon

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