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February 1999

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Subject:
Warp & Twist
From:
"Wang, William(Suzhou Laminate)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 8 Feb 1999 23:44:00 -0700
Content-Type:
text/plain
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text/plain (22 lines) 
   Is there anyone can help me on warp & twist issue? Some company will go
through HASL instead of baking when performing W/T test for laminate IQC
inspection. Is there any big difference between these two method?
   What's the current W/T spec that PCB companies are looking for? (IPC-4101
says 1.0%, but some customers need 0.5%.)

Thanks in advance

Bill Wang

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