I hope this reply comes close to what is being discussed. Over the past year, especially, I have
used three different repair/rework machines (Conceptronic, Pace, and now SRT). Recently, I have seen
the phenomonon with PBGA's and perimeter BGA's (432 balls).

I just keep in mind that either way you look at BGA balls, they are attached to a PCB. That is,
after reflow, BGA balls are wetted and soldered to a PCB. During device assembly, they are attached
to the device PCB. Process management requirements are nearly the same for both. I mean the BGA PCB
must be solderable as well as the board. If not, non-wetting is the effect.

Earl Moon

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################