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February 1999

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Subject:
From:
Russ Winslow <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 8 Feb 1999 12:50:12 -0800
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text/plain
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text/plain (37 lines)
Jim,
We are seeing it only on plastic BGAs with 63/37 solder balls (so far).  We
too saw it in isolated cases but now we see it all the time.  These are pads
with no (zero) solder on them and/or pads with a small icicle in the very
center.  We even see pads with a ring of solder surrounding a non-wetted
center.  The problem is, we now see it on nearly every lot we receive for
reballing.  Kinda makes ya wonder?


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Jim Marsico
516-595-5879
Sent: Monday, February 08, 1999 12:01 PM
To: [log in to unmask]
Subject: Re: [TN] Defective BGAs?

Dear Russ...

This is something I've noticed in the past... I thought it was an isolated
case.  Could you tell me the types of BGAs you see this phenomenon on?  Are
they predominantly ceramic?  Plastic?  Both?  If ceramic, are the component
pads on the same level as the ceramic or are they recessed?  What solder
alloy?
Any information you can provide may be helpful.

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