Jim,
     It is true that subsequent processes add some level of contaminants to
     surface.  However, many folks provide wire bondable product in this
     manner.  Without having wire bond pull tests performed, it is
     impossible to determine the negative affects.  It is important that
     rinses following strip, etch and mask are fresh and drying is
     complete.  In addition, a follow-up dip in a soap cleaner, such as
     LAC-91 (Dynachem) followed by a good rinsing and drying will help
     remove any visible staining.  Finally, an O2 plasma cycle should
     always be used to burn off remaining organics.

     Andy



______________________________ Reply Separator _________________________________
Subject: [TN] Soft gold electroplate
Author:  Jim Douglas <[log in to unmask]> at SMTPLink-Hadco
Date:    02/05/99 2:48 PM


If the only method of manufacturing a board requiring soft gold electroplate (on
Nickel), is to use the pattern plate process, I assume that the subsequent
process operations eg. strip,etch, solder resist will inhibit the success of any
gold wire bonding operation. Is this true, and if so how can the surface be
re-activated ?

Jim Douglas
Kam Circuits
Calne
England

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