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February 1999

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Subject:
Soft gold electroplate
From:
Jim Douglas <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 5 Feb 1999 14:48:04 -0000
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If the only method of manufacturing a board requiring soft gold electroplate (on Nickel), is to use the pattern plate process, I assume that the subsequent process operations eg. strip,etch, solder resist will inhibit the success of any gold wire bonding operation. Is this true, and if so how can the surface be re-activated ?

Jim Douglas
Kam Circuits
Calne
England

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