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February 1999

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Subject:
From:
Gabriela Bogdan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 5 Feb 1999 09:35:16 +0200
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Hamilton, Richard -4454 wrote:

> Hello all,
>
> I wanted to get a 'heads up' on a possible problem so I asked this
> several
> months ago and got no reply. I thought, Great! This is not a problem!!
>
> Well, not so sure now. The peelable masking we are using on our PWB's
> seems
> to be getting tougher to remove after reflow process has been added to
> the
> system.
>
> Anyone have any suggestions, guidelines, or other input on what to
> look for
> or what to look out for? We will have to start looking at other
> vendors for
> the masking. Sorry but I cannot tell you the mfgr right now, our PWB
> designer is out today. If this information is needed, let me know and
> when I
> get it I will let you know.
>
> Thanks gang.
>
> Richard Hamilton
> Clemar Mfg. / Rain Bird
> [log in to unmask]
>
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 Hi,
We use currently peelable solder mask coated circuits. the mask is
applied by the circuit manufacturer on connector areas which are press
fit mounted after reflow and wave soldering.
The manufacturer delivers the circuits with a little "underpolymerised"
peelable mask-it actually somehow breaks when trying to remove it before
assembly.
After assembly it reaches the right physical properties and peels off
easily from the surface and the holes.
Though, the peelable solder mask manufacturer PETERS has two brands of
"blue" and only one of them is suitable for our process, the other
exhibiting just the same problems as you describe.
We specify the brand in our order.
Bye
Gaby

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