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February 1999

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Subject:
Re: Rework information
From:
Bruce Stacy <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 19 Feb 1999 13:09:19 -0500
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text/plain
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One word . . . Caution.  Gold and lead form an intermetallic and this can
lead to peeling on reworked contacts.  It might be a better approach to
strip off the gold as well and then replate with gold.  I know of some
shops that strip both gold and nickel  when reworking contact areas. It is
a lot easier to activate Cu for subsequent plating than it is Ni.  If the
Ni isn't fully acitvated this too can lead to peeling.

Bruce




[log in to unmask] on 02/18/99 02:18:50 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
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To:   [log in to unmask]
cc:    (bcc: Bruce Stacy/ECSDOMAIN)
Subject:  [TN] Rework information




Gold contact rework

We are replating gold contacts that has been contaminated with solder
paste.  The process is to remove the solder paste from the contacts, clean
the area and then apply gold using the same principle of pcb gold plating.
Is there any reliability issue with such process?  Is there any particular
analysis to validate the process?

Any information in this matter will be helpful.

Enid Dávila

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