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Fri, 26 Feb 1999 17:12:21 -0500 |
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R@D Circuits, Edison, NJ; 732-549-4554; Alan Fogelstrum
"Vaughan, John" <[log in to unmask]> on 02/26/99 03:21:09 PM
Please respond to "\"TechNet E-Mail Forum.\" <[log in to unmask]>,
\"Vaughan, John\"" <[log in to unmask]>
To: [log in to unmask]
cc: (bcc: Bruce Stacy/ECSDOMAIN)
Subject: [TN] Gold Wire Bonding
Good afternoon:
We are researching for a source of supply for Mil-approved printed circuit
on polyimide materials that is capable of supplying gold wire bond plating.
All assistance appreciated.
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