TECHNET Archives

February 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mime-Version:
1.0
Sender:
TechNet <[log in to unmask]>
Subject:
Solder tip to ground parameters
From:
Armando Melara <[log in to unmask]>
Date:
Fri, 12 Feb 1999 11:16:38 -0800
Content-Type:
text/plain; charset="us-ascii"
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Armando Melara <[log in to unmask]>
Parts/Attachments:
text/plain (27 lines) 
Since Mil-Std-2000 has been obsoleted I been in fix trying to find a direct
reference to values of solder tip to ground resitance and solder tip to
ground voltage leakage in the J-std 001 or the IPC 610, and even in the EIA
625.

Does anyone know what the current industry standard is that references both
of these values?

Thanks


Armando Melara
Quality Assurance
SST, Inc.

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2