I am reminded of a direct and timely correspondence from Motorola (though now somewhat dated - an
invitation to those kind folks to once again join in) concerning phosphorous/nickel intermetallic
formations (from electroless nickel deposition process) rendering both BGA device and PCB
bond/solder joint reliability null and void.
Earl Moon
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################