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February 1999

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Subject:
From:
Ryan Jennens <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 25 Feb 1999 11:07:47 -0500
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Mornin everybody-

        We just tried running our first pin-in-paste (paste-in-hole, etc.) process
for manufacturing a board which has only four through-hole parts.
Everything went well except for a 9-pin Amp D-subconnector.  This part did
not solder because it seems that we could not get enough heat to the part.
The paste did not reflow and the parts around it did not either (surface
mount included).  Can you suggest any ways to heat up this big "heatsink" of
a part and get the pins (underneath the connector) to reflow?
        And Steve-  I am still working on your explanation.

Ryan Jennens
TelGen Corporation

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